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Online Seminar | Design and Heterogeneous Integration of Microelectronic Systems
17 February 2021, 11:30 am鈥�12:30 pm
Tolga Tekin, group manager of Photonics and Plasmonics Systems at Fraunhofer IZM will explore key concepts of design and integration of microelectronic systems when considering next-generation computing, data centres, and other massive communication applications.
This event is free.
Event Information
Open to
- All | 香港六合彩 staff | 香港六合彩 students
Availability
- Yes
Cost
- Free
Organiser
-
Robert Thompson – Institute of Communications and Connected Systems
Location
-
N/AN/AN/AWC1A 1AA
Design and Heterogeneous Integration of Microelectronic Systems
This talk considers the key concepts of design and heterogeneous integration for microelectronic systems. It will discuss how design and heterogeneous integration techniques are demanded with respect to massive communication applications, such as datacenters and next generation computing.
A key bottleneck to the realization of high-performance microelectronic systems is the lack of low-latency, high-bandwidth, and high density off-chip/core interconnects. Some of the challenges in achieving high-bandwidth chip-to-chip communication using electrical interconnects include the high losses in the substrate dielectric, reflections and impedance discontinuities, and susceptibility to crosstalk. Obviously, the motivation for the use of photonics is to overcome these challenges and leverage low-latency and high-bandwidth communication.
ICCS Chair
This session will be chaired by: Izzat Darwazeh
Attending the seminar听
The Seminar will be held on the Zoom platform.
Please click this URL to join.
Webinar ID: 944 1492 8346
Password: Will be distributed to ICCS members, others are welcome to join and听the password can be requested by email.
About the Speaker
Tolga Tekin
Group manager of Photonics and Plasmonics Systems at Fraunhofer IZM
Tolga Tekin has received the Ph.D. degree in electrical engineering and computer science from the Technical University of Berlin, Berlin, Germany, in 2004. He was a Research Scientist with the Optical Signal Processing Department, Fraunhofer HHI, where he was engaged in advanced research on optical signal processing, 3R-regeneration, all-optical switching, clock recovery, and integrated optics. He was a Postdoctoral Researcher on components for O-CDMA and terabit routers with the University of California. He worked at Teles AG on phased-array antennas and their components for skyDSL. At the Fraunhofer Institute for Reliability and Microintegration (IZM), he then led projects on optical interconnects and silicon photonics packaging. At the Technical University of Berlin, he then engaged in microsystems, photonic integrated system-in-package, photonic interconnects, and 3-D heterogeneous integration research activities. He is group manager of Photonics and Plasmonics Systems at Fraunhofer IZM and coordinator of 鈥楶hoxLab - European Photonics Innovation Hub for Optical Interconnects鈥� at Fraunhofer IZM. He has been coordinator of European Flagship project on optical interconnects 鈥楩P7-PhoxTroT鈥�, 鈥楬2020-L3MATRIX鈥�, and is currently coordinating 听鈥楬2020-MASSTART鈥�.